Overseas report says Samsung’s Exynos 2700 is fast, cool, too
What you need to know
- An overseas report says that Samsung is already pushing ahead with its plans for the Exynos 2700, which could see an increase in all of its devices next year.
- It is said that the heat production of the chip is a factor, as Samsung can work to improve the HPB technology present in the 2600 in the next iteration.
- The Exynos 2600 was exclusive to its South Korean market, however, the company says it boasts a 39% increase in CPU and “double” GPU power with the 2nm process.
It seems that Samsung is feeling good vibes with its Exynos 2600, as reports say that the sequel is already underway.
A report from Korean publication, Yonhap News, says that Samsung will go all out on its next Exynos chip (via Android Headlines). The post alleges that the Korean OEM has already “completed the design” of its next-generation chip, the Exynos 2700. It cites an “industry source” that says Samsung is trying to ride the high performance of the Exynos 2600, which has “surpassed” Qualcomm’s latest chip in some aspects.
The Exynos 2700 is rumored to be built on a 2nm process, similar to the Exynos 2600. Thermal management, according to Yonhap News, is an area that Samsung is putting under the microscope. Reportedly, the company is looking to build upon its existing Heat Path Block (HPB) packaging technology in the 2600.
HPB is said to help dissipate the heat generated by the phone more quickly. There is “confidence” in the performance of the Exynos 2700, as well, and the implementation of the chip in many Galaxy devices, such as the Galaxy S27 series next year, can help reduce its cost to consumers.
However, Samsung has reportedly started producing samples of its chip in preparation for its full production later this year.
You’re already looking to the next one
The Exynos 2600 debuted in December after a long history of leaks and reports about what it could offer consumers. Built on the 2nm process, Samsung says that the chip abandons its low-power cores and adopts a new CPU structure that facilitates higher performance and better efficiency. The company suggests an increase in CPU by 39% and “double” the power of the GPU 2500.
One of the biggest problems consumers had in the past was how weak Samsung’s Exynos chips were. Additionally, the chip series has faced heat issues, as devices can experience overheating issues on a regular basis. HPB is said to solve this problem, as it is introduced on the chip. The folks at Android Headlines say the chip can place components next to each other, instead of stacking them. We will have to see how things progress as we await the Galaxy S27 series.
Android Central Take
Heating issues are probably what I look at the most here. I won’t go into Samsung’s “power” or “performance” with the Exynos 2600, as the chip seems to have done well. It has a new 2nm process, acceptable CPU and GPU changes, so it seems to be on the right track. Heat generation is the next thing to be removed. There’s no way to completely remove the heat (it’s a phone, after all, that needs to work). But if Samsung can continue to cool things down, especially while people are gaming and more, that will undoubtedly be a big help.
